i ntegrated c ircuits d ivision www.ixysic.com ds-CPC1035N-r16 1 CPC1035N 350v normally-open single-pole 4-pin sop optomos ? relay part # description CPC1035N 4-pin sop (100/tube) CPC1035Ntr 4-pin sop (2000/reel) * for other packaging options consult factory. parameter rating units blocking voltage 350 v p load current 100 ma rms / ma dc on-resistance (max) 35 ? applications features description ordering information pin configuration ? telecommunications ? telecom switching ? tip/ring circuits ? modem switching (laptop, notebook, pocket size) ? hook switch ? dial pulsing ? ground start ? ringing injection ? instrumentation ? multiplexers ? data acquisition ? electronic switching ? i/o subsystems ? meters (watt-hour, water, gas) ? medical equipment?patient/equipment isolation ? security ? aerospace ? industrial controls ? 1500v rms input/output isolation ? small 4-pin sop package ? low drive power requirements ? high reliability ? arc-free with no snubbing circuits ? no emi/rfi generation ? halogen-free ? flammability rating ul 94 v-0 ? tape & reel version available the CPC1035N is a miniature normally-open, single-pole, (1-form-a) solid state relay in a 4-pin sop package that employs optically coupled mosfet technology to provide 1500v rms of input to output isolation. the efficient mosfet switches and photovoltaic die use ixys integrated circuits division?s patented optomos architecture while the optically coupled output is controlled by a highly efficient infrared led. ixys integrated circuits division?s state of the art double-molded vertical construction packaging makes the CPC1035N one of the world?s smallest relays. it offers board space savings of at least 20% over the competitor?s larger 4-pin sop relay. approvals switching characteristics of normally-open devices form-a i f i load 10% 90% t on t off 1 2 3 4 + control C control load load ? ul recognized component: file e76270 ? csa certified component: certificate 1172007 ? en/iec 60950-1 certified component: certificate b 13 12 82667 003
i ntegrated c ircuits d ivision www.ixysic.com 2 r16 CPC1035N absolute maximum ratings are stress ratings. stresses in excess of these ratings can cause permanent damage to the device. functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. typical values are characteristic of the device at +25c, and are the result of engineering evaluations. they are provided for information purposes only, and are not part of the manufacturing testing requirements. absolute maximum ratings @ 25oc parameter ratings units blocking voltage 350 v p reverse input voltage 5 v input control current 50 ma peak (10ms) 1 a input power dissipation 70 mw total power dissipation 1 400 mw isolation voltage, input to output 1500 v rms operational temperature -40 to +85 c storage temperature -40 to +125 c 1 derate linearly 3.33 mw / oc parameter conditions symbol min typ max units output characteristics load current continuous 1 -i l - - 100 ma rms / ma dc peak t=10ms i lpk - - 350 ma p on-resistance 2 i l =100ma r on -3035 ? off-state leakage current v l =350v p i leak --1a switching speeds turn-on i f =5ma, v l =10v t on --2 ms turn-off t off --1 output capacitance i f =0ma, v l =50v, f=1mhz c out -9 - pf input characteristics input control current to activate 3 i l =100ma i f - 0.8 2 ma input control current to deactivate - i f 0.3 0.7 - ma input voltage drop i f =5ma v f 0.9 1.2 1.5 v reverse input current v r =5v i r - - 10 a input to output characteristics capacitance, input to output v io =0v, f=1mhz c io - 0.7 1.45 pf 1 load current derates linearly from 100ma @ 25 o c to 70ma @85 o c. 2 measurement taken within 1 second of on-time. 3 for applications requiring high temperature operation (greater than 60 o c) a minimum led drive current of 4ma is recommended. electrical characteristics @ 25oc
i ntegrated c ircuits d ivision CPC1035N www.ixysic.com 3 r16 *unless otherwise noted, data presented in these graphs is typical of device operation at 25oc. for guaranteed parameters not indicated in the written speci? cations, please contact our application department. 35 30 25 20 15 10 5 0 26 28 30 32 27 29 31 device count (n) typical on-resistance distribution (n=50, i f =2ma, i l =100ma) on-resistance ( : ) 0.60 0.70 0.80 0.55 0.65 0.75 0.85 led current (ma) device count (n) 25 20 15 10 5 0 typical i f for switch operation (n=50, i l =100ma) 25 20 15 10 5 0 0.60 0.70 0.80 0.55 0.65 0.75 0.85 led current (ma) device count (n) typical i f for switch dropout (n=50, i l =100ma) 35 30 25 20 15 10 5 0 377.5 399.5 421.5 443.5 388.5 410.5 432.5 blocking voltage (v p ) device count (n) typical blocking voltage distribution (n=50) 0.50 0.70 0.90 1.10 0.60 0.80 1.00 turn-on time (ms) device count (n) 25 20 15 10 5 0 typical turn-on time (n=50, i f =5ma, i l =100ma) 0.21 0.23 0.25 0.27 0.26 0.24 0.22 turn-off time (ms) device count (n) 25 20 15 10 5 0 typical turn-off time (n=50, i f =5ma, i l =100ma) 35 30 25 20 15 10 5 0 1.17 1.19 1.21 1.23 1.25 led forward voltage drop (v) device count (n) typical led forward voltage drop (n=50, i f =5ma) led forward voltage drop (v) temperature (oc) typical led forward voltage drop vs. temperature 1.8 1.6 1.4 1.2 1.0 0.8 -40 -20 0 20 40 60 80 120 100 i f = 50ma i f = 30ma i f = 20ma i f = 10ma i f = 5ma led forward current (ma) turn-on time (ms) 0 5 1015202530354045 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 50 typical turn-on time vs. led forward current (i l =100ma) led forward current (ma) turn-off time (ms) 0 5 1015202530354045 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 50 typical turn-off time vs. led forward current (i l =100ma) performance data*
i ntegrated c ircuits d ivision www.ixysic.com 4 r16 CPC1035N i f = 5ma i f = 10ma turn-on time (ms) -40 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 -20 0 20 40 60 80 100 typical turn-on time vs. temperature (i l =50ma) temperature (oc) turn-off time (ms) -40 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -20 0 20 40 60 80 100 i f = 5ma i f = 10ma temperature (oc) typical turn-off time vs. temperature (i l =50ma) -40 60 50 40 30 20 10 0 -20 0 20 40 60 80 100 temperature (oc) on-resistance ( : ) typical on-resistance vs. temperature (i f =10ma, i l =50ma) led current (ma) -40 3.0 2.5 2.0 1.5 1.0 0.5 0 -20 0 20 40 60 80 100 typical i f for switch operation vs. temperature (i l =50ma) temperature (oc) led current (ma) -40 3.0 2.5 2.0 1.5 1.0 0.5 0 -20 0 20 40 60 80 100 temperature (oc) typical i f for switch dropout vs. temperature (i l =50ma) load voltage (v) load current (ma) 150 100 50 0 -50 -100 -150 -3 -2 -1 0 1 2 3 typical load current vs. load voltage (i f =5ma) load current (ma) 180 160 140 120 100 80 60 40 20 0 temperature (oc) -40 -20 0 20 40 60 80 120 100 i =5ma f i =10ma f typical maximum load current vs. temperature blocking voltage (v p ) -40 430 425 420 415 410 405 400 395 -20 0 20 40 60 80 100 temperature (oc) typical blocking voltage vs. temperature leakage (a) -40 0.016 0.014 0.012 0.010 0.008 0.006 0.004 0.002 0 -20 0 20 40 60 80 100 typical leakage vs. temperature measured across pins 3&4 (v l =350v) temperature (oc) load voltage (v) 0 50 100 150 200 250 300 350 output capacitance (pf) 0 10 20 30 40 50 output capacitance vs. load voltage (i f =0ma, f=1mhz) time load current (a) 10 p s 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 1ms 100 p s 100ms 1s 10ms 10s 100s energy rating curve performance data* *unless otherwise noted, data presented in these graphs is typical of device operation at 25oc. for guaranteed parameters not indicated in the written speci? cations, please contact our application department.
i ntegrated c ircuits d ivision CPC1035N www.ixysic.com 5 r16 manufacturing information moisture sensitivity all plastic encapsulated semiconductor packages are susceptible to moisture ingression. ixys integrated circuits division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, ipc/jedec j-std-020 , in force at the time of product evaluation. we test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. this product carries a moisture sensitivity level (msl) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard ipc/jedec j-std-033 . device moisture sensitivity level (msl) classi cation CPC1035N msl 3 esd sensitivity this product is esd sensitive , and should be handled according to the industry standard jesd-625 . soldering profile provided in the table below is the classification temperature (t c ) of this product and the maximum dwell time the body temperature of this device may be (t c - 5)oc or greater. the classification temperature sets the maximum body temperature allowed for this device during lead-free reflow processes. for through-hole devices, and any other processes, the guidelines of j-std-020 must be observed. device classi cation temperature (t c ) dwell time (t p ) max re ow cycles CPC1035N 260oc 30 seconds 3 board wash ixys integrated circuits division recommends the use of no-clean flux formulations. board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. these precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. additionally, the device must not be exposed to flux or solvents that are chlorine- or fluorine-based.
i ntegrated c ircuits d ivision ixys integrated circuits division makes no representations or warranties with respect to the accuracy or completeness of the co ntents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit patent licenses nor indemnity a re expressed or implied. except as set forth in ixys integrated circuits division?s standard terms and conditions of sale, ixys integrated circuits division assumes no liability whatsoever, a nd disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringem ent of any intellectual property right. the products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of ixys integrated circuits division?s product may resul t in direct physical harm, injury, or death to a person or severe property or environmental damage. ixys integrated circuits division reserves the right to discontinue or make changes to its p roducts at any time without notice. specification: ds-CPC1035N-r16 ?copyright 2017, ixys integrated circuits division optomos? is a registered trademark of ixys integrated circuits division all rights reserved. printed in usa. 5/25/2017 for additional information please visit our website at: www.ixysic.com 6 CPC1035N dimensions mm (inches) note: all dimensional tolerances per standard eia-481-2 except as noted embossment embossed carrier 330.2 dia (13.00 dia) top cover tape thickness 0.102 max (0.004 max) u ser direction o f feed user direction of feed k 0 =2.70 (0.106) k 1 =2.30 (0.091) b 0 =4.70 (0.185) w=12.00 (0.472) p=8.00 (0.315) a 0 =6.50 (0.256) mechanical dimensions CPC1035N CPC1035Ntr tape & reel CPC1035N device weight = 0.075 grams recommended pcb land pattern 2.54 (0.10) 5.50 (0.217) 1.45 (0.057) 0.55 (0.022) dimensions mm (inches) pin 1 4.089 0.025 (0.161 0.001) 2.54 typ (0.100 typ) 6.096 0.102 (0.240 0.004) 3.810 0.025 (0.150 0.001) 0.559 0.127 (0.022 0.005) 0.910 0.025 (0.036 0.001) 2.030 0.025 (0.080 0.001) 0.381 typ. (0.015 typ.) pin to package standoff: 0.064 0.040 (0.0025 0.0015) 0-0.1 (0-0.004) 0.481 (0.019) 0.203 typ (0.008 typ)
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